http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022227517-A1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_40b8a929005d0212a0488d2bbeab1803
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
filingDate 2021-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03195a8b899a1cb2649b4feab9b4df62
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publicationDate 2022-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2022227517-A1
titleOfInvention Enhanced conductive paste and electronic device
abstract The present application relates to the technical field of new materials. Provided are an enhanced conductive paste and an electronic device. The enhanced conductive paste provided in the present application is composed of the following materials, in percentage by weight: 4%-20% of a resin, 4%-10% of a curing agent, 50%-80% of a conductive filler, 5%-35% of a reinforcing filler, 5%-25% of a solvent, and 0.05%-4% of an auxiliary, wherein the reinforcing filler comprises whiskers having a tensile strength not less than 1 GPa, a linear or fibrous reinforcement structure, and a metal layer that coats the reinforcement structure, the electrical conductivity of the metal layer being better than that of the reinforcement structure; and the length of the reinforcing filler ranges from 0.1 μm to 25 μm. By means of the technical solution of the present application, the adhesion strength between a conductive structure in an electronic device and a base material in same can be increased.
priorityDate 2021-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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