http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113192663-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_40b8a929005d0212a0488d2bbeab1803
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-24
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
filingDate 2021-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e887e35973debab86841c5ba12f5907
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03195a8b899a1cb2649b4feab9b4df62
publicationDate 2021-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113192663-A
titleOfInvention A kind of enhanced conductive paste and electronic device
abstract The invention provides an enhanced conductive paste and an electronic device, and relates to the technical field of new materials. The reinforced conductive paste provided by the present invention is composed of the following materials by weight percentage: 4%-20% resin, 4%-10% curing agent, 50%-80% conductive filler, 5%-35% reinforcing filler, 5% to 25% of solvent and 0.05% to 4% of auxiliary agent; the reinforcing filler includes whiskers with a tensile strength of 1 GPa or more, a linear or fibrous reinforcing structure, and a metal coated on the outside of the reinforcing structure layer, the electrical conductivity of the metal layer is better than that of the reinforcing structure; the length of the reinforcing filler is 0.1 μm˜25 μm. The technical scheme of the present invention can improve the adhesion between the conductive structure and the substrate in the electronic device.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022227517-A1
priorityDate 2021-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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