| abstract |
The present invention relates to a semiconductor-packaging device and, more specifically, to a semiconductor-packaging device for packaging a semiconductor device through a wafer level packaging method. A semiconductor-packaging device according to an embodiment of the present invention comprises: a loading unit having a space in which a mask member can be arranged on a wafer including a plurality of semiconductor devices; a deposition unit which has a space in which the wafer and the mask member are received from the loading unit to form a conductive pattern layer on the wafer, and which is connected to the loading unit; and an unloading unit which has a space in which the wafer and the mask member are received from the deposition unit to separate the mask member from the wafer, and which is connected to the deposition unit. |