http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022220037-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ec83ea8e6721b1a5654b038fdb9b223f http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bb4ee28d43b5e8d4a3c5141fa9bcfeb0 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2022-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da7853ea986fe0ebd47bada553161428 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98b1ce53a5890dbace1ff9b4ef0b9088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84b984a98b28ce8e2e88d3da4328de30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e376ecc0f188028dfab9f1674f0d017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25590a38e5ad40bbb9d18958cc9bf569 |
| publicationDate | 2022-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2022220037-A1 |
| titleOfInvention | Substrate processing method, substrate processing device, and drying process liquid |
| abstract | This substrate processing method comprises: a step for supplying a chemical liquid to the surface of a substrate (step S11); a step for supplying a rinse liquid to the surface of the substrate after step S11 (step S12); a step for bringing a drying process liquid that has been heated into contact with the surface of the substrate after step S12 (step S14); and a step for drying the substrate by removing the drying process liquid from the surface of the substrate after step S14 (step S15). The surface tension of the drying process liquid is lower than the surface tension of the rinse liquid. The boiling point of the drying process liquid is higher than the boiling point of the rinse liquid. The temperature of the drying process liquid that comes into contact with the surface of the substrate in step S14 is a prescribed contact temperature that is at least the boiling point of the rinse liquid and is less than the boiling point of the drying process liquid. In this way, it is possible to inhibit pattern collapse during a drying process. |
| priorityDate | 2021-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.