http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022172734-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-28 |
| filingDate | 2022-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25f581a60c4cd66b7bf125ee717b8af4 |
| publicationDate | 2022-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2022172734-A1 |
| titleOfInvention | Polymer composition for porous-film formation, method for producing porous film, porous film, flexible metal-clad laminate, and electronic board |
| abstract | Provided is a polymer composition for forming a porous film which has a low permittivity and a low dielectric dissipation factor and in which problems concerning liquid permeability and water absorption have been mitigated and the fear of decreasing in mechanical strength has been suppressed. The polymer composition for porous-film formation comprises a polymer, a solvent (A), and a solvent (B), wherein the solvent (A) has a boiling point of 100°C or higher, a 10 mass% solution of the polymer in the solvent (A) has a 25°C viscosity of 150 dPa·s or higher, the solvent (B) has a boiling point lower than 100°C, and a 10 mass% solution of the polymer in the solvent (B) has a 25°C viscosity less than 50 dPa·s. |
| priorityDate | 2021-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.