| abstract |
The purpose of the present invention is to provide a metal laminate molding flow path member having levels of both surface roughness and corrosion resistance within the flow path that make possible use thereof as a flow path member used for a corrosive fluid supply line of a semiconductor device manufacturing apparatus. A metal laminate molding flow path member according to the present invention is one through which a corrosive fluid passes, and is characterized in that: a metal base body for forming the same has an uneven surface; the inner surface of the flow path of the metal laminate molding flow path member is formed with a glass coating layer so as to fill in at least the recessed regions of the uneven surface of the metal base body; and the glass coating layer includes at least one layer of a P 2 O 5 -ZnO-Al 2 O 3 glass layer, a Bi 2 O 3 -ZnO-B 2 O 3 glass layer, and a SiO 2 -B 2 O 3 -Na 2 O glass layer. |