| abstract |
Provided is a metal foil with a carrier with which rough circuit exposure and fine circuit exposure can both be carried out on the basis of the same alignment mark during wiring formation, and as a result thereof, a rough circuit and a fine circuit can be formed simultaneously in a single-stage circuit formation process. The metal foil with a carrier comprises: a carrier; a release layer provided on at least one surface of the carrier; and a metal layer provided on the release layer. The metal foil with a carrier also includes: a wiring region in which the carrier, the release layer, and the metal layer are present across the entire wiring region; and at least two positioning regions that are provided to the at least one surface of the metal foil with a carrier, and that form alignment marks used for positioning during wiring formation accompanied by exposure and development. |