| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_543f81076a0539dda3718ef97249ec66 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823437
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823481 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0649
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76229
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823437
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76 |
| filingDate |
2019-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a31edfed3a3324dc052626b47e851113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72e8ca366c2c4a8d5ab8bbde5a9c262f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09685636d2e5fddd087455b2f00541fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_249e7a1a40e49cc1f3831f4fa73b2e0f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51ef8151cf92f7683f113b8c684a5b75 |
| publicationDate |
2020-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020125515-A1 |
| titleOfInvention |
Semiconductor structure and forming method therefor |
| abstract |
A semiconductor structure and a forming method therefor. In the semiconductor structure, an electrically conductive structure (300) is disposed on a trench isolation structure (200) so as to utilize the space above the trench isolation structure (200), thereby reducing the space in the whole semiconductor integrated circuit occupied by the electrically conductive structure (300) and facilitating the size reduction of the semiconductor integrated circuit formed. |
| priorityDate |
2019-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |