| abstract |
Sputtering device to sputter a liquid target (3), comprising a trough (2) to receive a liquid target material, characterized in that the device comprises means (25) to stir or agitate the liquid target material, the means being configured to degas the liquid target material or/and to dissipate solid particles or islands on a surface (4) of the target or/and to move such particles or islands from an active surface region (SA) to a passive surface region (SP) and/or vice-versa whereby the passive surface region (SP) is at least 50% less exposed to sputtering as the active surface region (SA). |