| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D73-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D85-671 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D85-90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D73-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D85-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-28 |
| filingDate |
2019-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7288d8c6fa473570d0e40f8eb882b77d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60fa0658f3fc76e5bc1b7a88a3c16f9d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68ce1787ebf0b42416898d6cb1bca0c8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c59a27257a6e85616b9a28d140857f15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0135f400568e805c6e61edada9de287c |
| publicationDate |
2020-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020059682-A1 |
| titleOfInvention |
Cover tape and packaging body for packaging electronic component |
| abstract |
The present disclosure provides a cover tape for packaging an electronic component, the cover tape having: a substrate layer; a heat-seal layer which is disposed on one surface side of the substrate layer and includes an ethylene-vinyl acetate copolymer; and an antistatic layer which is disposed on the opposite surface side of the surface of the heat-seal layer of the substrate layer and includes a conductive polymer, wherein the Vickers hardness of the heat-seal layer is a predetermined value or greater. |
| priorityDate |
2018-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |