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filingDate 2017-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40ea9ddb2f1e2979feb50853076e66bc
publicationDate 2018-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2018061442-A1
titleOfInvention Resin composition, cover tape, and electronic component package
abstract The resin composition according to the present invention is a resin composition that constitutes a sealant layer provided on one surface side of a cover tape that seals a carrier tape having a depression that can accommodate an electronic component. The resin composition according to the present invention comprises (A) a polyolefin resin, (B) an antistatic agent, and at least one of (C) a polystyrene resin and (D) a (meth)acrylate ester polymer. The polyolefin resin (A) contains a structural unit I derived from a carboxylic acid or a carboxylic acid derivative, and the proportion for the structural unit I derived from a carboxylic acid or a carboxylic acid derivative is 1-5 mass% inclusive with reference to the total amount of the polyolefin resin (A). The total content of the polystyrene resin (C) and (meth)acrylate ester polymer (D) is 3-65 parts by mass inclusive per 100 parts by mass of the resin composition.
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