| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67201 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11524
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2019-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50204095833eb5572042108bcde7dc80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_934f693749290445c95d2c2329563517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59d8b23c25b9daddb0d9a7fa439df29d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e477f2f1bf71ce96bd62960e993a4a51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d8911333c2e56626ab57d76f627b7b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca7f6f16ecddc673cb632bc395d88d9f |
| publicationDate |
2020-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020028119-A1 |
| titleOfInvention |
Non-selective and selective etching through alternating layers of materials |
| abstract |
Features are formed through alternating layers of a first material and a second material by performing an etch process with multiple etch cycles. Each of the etch cycles includes at least a non-selective etch and a selective etch. The non-selective etch etches through at least one or more layers of the first material. The non-selective etch may further etch through one or more layers of the second material and/or partially through a layer of the second material. The selective etch etches through at least a layer of the second material without etching through a layer of the first material. Multiple etch cycles are repeated until a final depth of the features is reached. |
| priorityDate |
2018-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |