| abstract |
Provided is a polishing composition that has excellent ability to eliminate bulging around an HLM. This polishing composition is for pre-polishing a silicon substrate. The polishing composition includes abrasive grains, a basic compound, a surfactant, and water. According to one favorable embodiment, the polishing composition includes, as the surfactant, a surfactant A1 that has a quaternary ammonium betaine structure. According to another favorable embodiment, the polishing composition includes, as the surfactant, a surfactant A2 that includes a quaternary ammonium salt structure but does not include an oxyalkylene structure. |