http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019044051-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2afaa30d5877bd844cc746db821920 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-14 |
| filingDate | 2018-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc615e27b9615fb2524a6388a923d952 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe84de816e987af91e17bbca471d816a |
| publicationDate | 2019-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2019044051-A1 |
| titleOfInvention | Method of manufacturing printed wiring board, printed wiring board, method of manufacturing multilayer printed wiring board, and multilayer printed wiring board |
| abstract | Provided are a method for manufacturing a printed wiring board and a method for manufacturing a multilayer printed wiring board, which can improve the adhesion between a printed wiring board and a substrate such as a heat sink, and the adhesion between printed wiring boards. A method of manufacturing a printed wiring board according to the present invention includes a resin laminating step of laminating a first resin in a semi-cured state and a second resin in a semi-cured state, and a wiring pattern forming step of forming a wiring pattern on the first resin A first resin curing step of curing the first resin while maintaining the semi-cured state of the second resin, a substrate bonding step of bonding the second resin and the substrate, and 2. A second resin curing step of curing the resin and bonding the second resin and the substrate, the first resin contains a first polymerization initiator, and the second resin is a second resin. 2 containing a polymerization initiator. |
| priorityDate | 2017-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 315.