http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08174755-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_097405822d505467fd50f7100022cd56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1994-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85b9bc456cb06fd0a355dc957310fae0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_540bc7dfecf4c2881fa3b2dd98373916 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94435ab227f326190f3eeaf45b14b21a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_705ba8535a90ee52fc9dab4c8c371e8a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6ddb2bdb7b8e73eab1d3125c4c7ab6f |
| publicationDate | 1996-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08174755-A |
| titleOfInvention | Copper-clad insulating sheet and method for manufacturing multilayer printed wiring board |
| abstract | (57) [Summary] [Construction] The present invention provides a first resin composition which is alkali-soluble and has ultraviolet curability on the roughened surface of a copper foil, and which is electron beam curable and / or thermosetting. Of the first resin composition, does not have ultraviolet curability on the layer of the first resin composition, is soluble in alkali, has high fluidity when heated, and has an electron beam curability and / or a thermosetting curability. A copper-clad insulating sheet formed by forming a layer of the resin composition of 2, and a method for producing a multilayer printed wiring board using the sheet. [Effect] When the copper-clad insulating sheet of the present invention is used, the sheet and the inner layer panel are laminated by roll lamination, and the cavity or the cavity and the blind via are formed by etching the copper foil and dissolving only the unnecessary resin layer portion with an alkali. Since holes can be formed collectively, Productivity is greatly improved compared to conventional counterboring and drilling, where holes were drilled one by one. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007088477-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009069683-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009069683-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009099065-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010140214-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019046968-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019044051-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4648277-B2 |
| priorityDate | 1994-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 91.