http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018236358-A1

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filingDate 2017-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2021c0a8c6be539f82f28bcfd39b322
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publicationDate 2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2018236358-A1
titleOfInvention DUAL PATTERN FORMATION ALLOWED BY ION IMPLANTATION CHARACTERISTICS DEFINED BY SPRAYING
abstract The present invention provides dual patterning approaches based on spray defined ion implantation characteristics, and integrated circuit structures resulting therefrom. For example, an integrated circuit structure comprises a plurality of semiconductor vanes. Individual fins of the plurality of semiconductor fins have xenon (Xe) or krypton (Kr) atoms therein. A concentration of the Xe or Kr atoms along the side walls of the individual fins of the plurality of semiconductor fins is greater than a concentration of the Xe or Kr atoms at the centers of the individual fins of the plurality of semi fins. -conductrices. A concentration of Xe or Kr atoms in upper portions of the plurality of semiconductor vanes is greater than a concentration of Xe or Kr atoms in lower portions of the plurality of semiconductor vanes.
priorityDate 2017-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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