| abstract |
The present invention provides a polishing composition which is thickened, while maintaining properties such as dispersibility of abrasive grains, polishing rate and reduced haze. The present invention is a polishing composition which contains abrasive grains, a basic compound, a water-soluble polymer A that has a function of protecting the surface of an object to be polished, a water-soluble polymer B that has a thickening function, and water. This polishing composition is configured such that: the weight average molecular weight of the water-soluble polymer B is 50,000 or more; the abrasive grain adsorption parameter 1 of the water-soluble polymer B obtained from a standard test 1 is 40% or less; and the substrate adsorption parameter 2 of the water-soluble polymer B obtained from a standard test 2 is 20% or less. |