| abstract |
A system for simultaneously burning in, testing and curing all the die on an uncut semiconductor wafer; for establishing electrical connectivity in one-to-one correspondence between each die and a specific current amplifier, for monitoring, displaying, evaluating and recording test parameters in relation to preset parametric limits during a requisite test period; and for shutting down any individual die that exceeds the preset parametric limits. Methods of use and subsystems for raising and lowering a semiconductor wafer in relation to a pin chuck and for controlling wafer temperature by circulating a liquid heat exchange medium through platen assemblies disposed above and below the wafer are also disclosed. |