| abstract |
Provided is a liquid concentrate of a composition for rough-polishing silicon wafers, which, when being diluted, is able to deliver preferable polishing performance, and which exhibits excellent stability. The liquid concentrate of a composition for rough-polishing silicon wafers provided by the present invention comprises abrasive particles, a basic compound, and a water-soluble polymer, wherein the ratio [rg/d] of the radius of gyration rg [nm] of the water-soluble polymer to the inter-particle distance d [nm] of the abrasive particles is 4.7 or less. |