| abstract |
The invention relates to thermoplastic molding compounds containing: A) 20 to 99.9 wt.% of a thermoplastic polyamide, B) 0.1 to 40 wt.% of an alkenyl succinic acid derivative which can be obtained by reacting polyisobutane (B1) with a number-average molecular weight Mn of 10,000 to 50,000 with maleic acid or derivatives (B2) thereof in a stoichiometric ratio of at least 2 equivalents of α,β-unsaturated mono- and dicarboxylic acid or derivatives (B2) thereof per reactive double bond in the polyisobutane (B1) at temperatures ranging from 180 to 250 °C for a duration of at least 15 minutes to 10 hours and at up to 10 bar overpressure, wherein the derivatives are selected from the group consisting of anhydrides, mono- or dialkyl esters, and mixed esters, and the reactive double bonds are the sum of the terminal α- and β-double bonds in the polyisobutane (B1), and C) 0 to 60 wt.% of additional auxiliary agents, the sum of the weight percentages of the components A) to C) equaling 100%. |