http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017115633-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1374dd16777534b65ad4422333245af8 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-266 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02529 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-266 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 |
| filingDate | 2016-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be0be52eb1816c3bb7f475d9203f8510 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c740db8afcc5072a95ebe1c3b18479ce |
| publicationDate | 2017-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2017115633-A1 |
| titleOfInvention | Photosensitive resin composition and method for manufacturing semiconductor device |
| abstract | Provided are: a low-cost photosensitive resin composition which has high-temperature heat resistance and conductivity and is capable of forming a pattern without a fear of producing a metal impurity with respect to a semiconductor base, and which is applicable to an ion implantation process at high temperatures; and a method for manufacturing a semiconductor device, which uses this composition.nA photosensitive resin composition according to the present invention contains a photosensitive resin and particles of a conductive material and/or a semiconductor material. In addition, a method for manufacturing a semiconductor device according to the present invention comprises: a step for forming a pattern (11) of a film of this photosensitive resin composition on a semiconductor layer or base (2); a step for forming a mask (13) for ion implantation by firing the pattern of a film of this photosensitive resin composition; a step for implanting ions into the semiconductor layer or base (2) through a pattern opening (12) of the mask for ion implantation; and a step for removing the mask (13) for ion implantation. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10937869-B2 |
| priorityDate | 2015-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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