http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017073434-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2016-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c542f37dd7b0d7bfe0c7fdac3e68833b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f67ed0d10eca23970047a24da8c46d2 |
| publicationDate | 2017-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2017073434-A1 |
| titleOfInvention | Primary mounting semiconductor device manufacturing method |
| abstract | The purpose of the present invention is to provide a bump base reinforced-type primary mounting semiconductor device manufacturing method by which a base portion on a primary mounting substrate side can be reinforced even with an expanded diameter solder bump. Provided is a bump base reinforced-type primary mounting semiconductor device manufacturing method which includes the following: a step A for preparing a reinforcing sheet provided with a base sheet and a thermosetting resin sheet which is laminated on the base sheet; a step B for preparing a primary mounting semiconductor device on a first main surface of which solder bumps are formed; a step C for affixing the thermosetting resin sheet of the reinforcing sheet to the first main surface of the primary mounting semiconductor device by applying heat and pressure while causing the solder bumps to be exposed from the thermosetting resin sheet; a step D, following step C, for obtaining the thermosetting resin sheet- equipped primary mounting semiconductor device, the device obtained by separating the thermosetting resin sheet and the base sheet in the reinforcing sheet; and a step E, following step D, for heating the thermosetting resin sheet. |
| priorityDate | 2015-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 139.