| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10977
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10734
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3457
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate |
2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e9d397f76a4c49f5458ac694343dd5e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a164e6543a83b4877c835cb71839199f |
| publicationDate |
2004-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004200394-A |
| titleOfInvention |
Method for manufacturing semiconductor device |
| abstract |
An object of the present invention is to provide a method of manufacturing a semiconductor device capable of improving connection reliability by bumps by more reliable and simple means. In a method of manufacturing a semiconductor device having a bump on a substrate, the bump has an elastic modulus (−55 ° C.) of 100 MPa to 5 GPa and a thickness of 5 to 40% of the bump height. A method for manufacturing a semiconductor device is provided, wherein a method for manufacturing a semiconductor device is provided in which a certain adhesive film is covered, and the adhesive film is provided on a substrate such that bumps penetrate and protrude from the adhesive film. [Selection diagram] FIG. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017073434-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017073345-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017078042-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102544368-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017078042-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180079337-A |
| priorityDate |
2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |