http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017068659-A1

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
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filingDate 2015-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d75ca4f0c70cd30603b549bb38979e9e
publicationDate 2017-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2017068659-A1
titleOfInvention Surface protection adhesive tape for semiconductor wafer backgrinding, and semiconductor wafer grinding method
abstract Provided are: a surface protection adhesive tape for semiconductor wafer backgrinding, said tape being composed of a substrate and an adhesive layer that is provided on one surface of the substrate, wherein the surface roughness of the substrate surface on which the adhesive layer is not formed is Rz = 0.7-5.0 μm, the total light transmittance of the surface protection adhesive tape for semiconductor wafer backgrinding at a wavelength of 500-600 nm is 40-80%, the difference between the color difference (ΔEM) of a mirror wafer and the color difference (ΔET) when the surface protection adhesive tape for semiconductor wafer backgrinding is bonded to the mirror wafer is ΔET-ΔEM > 6.5, and the surface protection adhesive tape for semiconductor wafer backgrinding is bonded to the surface of a semiconductor wafer having a notch; and a semiconductor wafer grinding method using said adhesive tape.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7260017-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023145926-A1
priorityDate 2015-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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