abstract |
The invention relates to a method for producing a substrate arrangement (10; 10'; 10") for connecting to an electronic component (30; 30"), comprising the steps of: - providing a substrate (11) having a first side (12) and a second side (13), - applying a contacting material layer (15) to the first side (12) of said substrate (11), and - applying a pre-fixation agent (18) to at least some sections of a side (16) of the contacting material layer (15) that faces away from said substrate (11). |