| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2865 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2887
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2891
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07307
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2865 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 |
| filingDate |
2016-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_154c415f87459e249532e2ada9579e18 |
| publicationDate |
2017-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017056643-A1 |
| titleOfInvention |
Wafer inspection method and wafer inspection device |
| abstract |
Provided is a wafer inspection method wherein a chuck top can be properly received. When an aligner 32 receives a chuck top 29 after a wafer W has been inspected, the distance between the chuck top 29 and a chuck base 49 is adjusted by adjusting the inclination of the chuck base 49 such that the chuck top height, which is the distance between the chuck top 29 and the chuck base 49, after the chuck top is held is a height in which any of 0 - 200 µm is added to the chuck top height before the chuck top is held. |
| priorityDate |
2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |