| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate |
2016-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d87d7b9ad64f60e219422dda68a53b90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f28ca0f72a88cff1709b6c404af8983
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7df826607bc3f67fde417d673f2e1b8 |
| publicationDate |
2017-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2017018232-A1 |
| titleOfInvention |
Roughened copper foil, copper-clad laminate, and printed wiring board |
| abstract |
Provided is a roughened copper foil that has good adhesiveness to resin as well as good abrasion resistance in spite of fine projections and recesses thereof having a low roughness suitable for fine-pitch circuit formation and high-frequency applications, and therefore stably exhibits good adhesiveness to resin even after rubbing against something during processing of a copper-clad foil or production of a printed wiring board. The roughened copper foil according to the present invention has a roughened surface having fine projections and recesses comprising acicular crystals and/or tabular crystals on at least one side thereof. The roughened surface has a maximum height Sz, as measured in accordance with ISO25178, of not more than 1.5 µm and an arithmetic mean peak curvature Spc, as measured in accordance with ISO25178, of not more than 1300 mm -1 . |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210002455-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6606317-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017179416-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018152331-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017179416-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10741848-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020031721-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102479331-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019208368-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112805413-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7350778-B2 |
| priorityDate |
2015-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |