| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0635
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate |
2014-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f2ad7bdcf2388e57381d9c062c4fbbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7172affc18f5090315af90b042a886ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a6606c52b032e92b11924f00632ea36 |
| publicationDate |
2015-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015134953-A |
| titleOfInvention |
Surface-treated copper foil, copper foil with carrier, printed wiring board, printed circuit board, copper-clad laminate, and printed wiring board manufacturing method |
| abstract |
The present invention provides a surface-treated copper foil excellent in fine wiring formability. A surface-treated copper foil having a surface-treated layer formed on a copper foil, and sprayed with a hydrogen peroxide / sulfuric acid-based copper-dissolved etching solution from a surface opposite to the surface on which the surface-treated layer is formed. A surface-treated copper foil in which the etching rate in the thickness direction of the surface treatment layer is 0.5 or more when the etching rate in the thickness direction of the copper foil is 1 when etched. [Selection] Figure 6 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018062706-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017018232-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017018232-A1 |
| priorityDate |
2014-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |