| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2016-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26bd540c97b885c93283a2eef8590722
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60e09b230a1ab2605dfaf99c572af9eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff9ec35fc541d73c74afd9e7642a6ac4 |
| publicationDate |
2016-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2016194431-A1 |
| titleOfInvention |
Method for manufacturing semiconductor device |
| abstract |
The present invention is characterized by including: a step for forming a resin layer (13) on the bump formation surface of a bump-equipped member (2) on which a plurality of bumps (22) are formed; and a step for performing a plasma treatment on the resin layer (13) to remove the resin layer (13) which covers the surface of the bumps (22). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017163059-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210093915-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210095863-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019189173-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7267259-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200138154-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019189173-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111656491-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020110619-A1 |
| priorityDate |
2015-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |