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publicationDate 2016-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2016076167-A1
titleOfInvention Resin composition, and insulating film and semiconductor device using same
abstract Provided are: an insulating film having excellent adhesive strength to metal foil that forms FPC wiring and to FPC substrate material such as polyimide film and exhibiting electrical characteristics in the high frequency range, specifically, low dielectric constant (ε) and low dielectric tangent (tanδ) in the 1-10 GHz frequency range; and a resin composition used in manufacturing said insulating film. This resin composition contains (A) a thermosetting resin having styrene groups on the ends and having a phenylene ether backbone, (B) a hydrogenated styrene thermoplastic elastomer, and (C) a polytetrafluoroethylene filler, and contains 40 mass% to 80 mass% of the component (C) with respect to the total mass of the components (A)-(C).
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