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publicationDate 2003-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003160662-A
titleOfInvention Method for producing polyphenylene oxide, polyphenylene oxide resin composition, prepreg, laminate, printed wiring board, and multilayer printed wiring board
abstract PROBLEM TO BE SOLVED: To provide a method for producing polyphenylene oxide, which can improve the moldability at the time of molding and reduce the dielectric constant and the dielectric loss tangent of a molded cured product. SOLUTION: The molecular weight is reduced by reacting polyphenylene oxide with a monofunctional phenol. The low molecular weight polyphenylene oxide obtained by the decomposition rearrangement reaction has a low polarity and a low dielectric constant, and can be suitably used as a molding material for a low dielectric constant laminated board.
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