http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015189432-A1

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filingDate 2015-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd8017417f272c3934b827d3a619575d
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publicationDate 2015-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2015189432-A1
titleOfInvention Method for manufacturing selective surface deposition using a pulsed radiation treatment
abstract The present invention relates to a method of manufacturing a direct and selective surface deposition by a pulsed radiation treatment. Said method allows the production of a selective pattern on any receiving material without any pre-treatment and/or post-treatment of said receiving material. The invention provides a selective deposition of a monolayer donor material onto a receiving material by means of a pulsed radiation treatment without any contact between said donor and receiving materials. It further provides a method of direct surface metallization of various types of receiving materials using a pulsed radiation treatment. The present invention provides a method of manufacturing a direct and selective surface deposition by a pulsed radiation treatment of a monolayer donor material onto a receiving material. The present invention relates more particularly to a method of manufacturing free form patterned deposition on surfaces of various receiving materials.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017125251-A1
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priorityDate 2014-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 36.