| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_97e705fa0022c85763b090ae72c31ec2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2015-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c92b62f68ece696a3e2cc2528f3b964a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac256a08b34d1008597b6a9371e31bfa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1978f7b1dcab79450084b45fb26947d |
| publicationDate |
2015-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2015152037-A1 |
| titleOfInvention |
Phenolic resin, epoxy resin composition containing said phenolic resin, cured product of said epoxy resin composition, and semiconductor device equipped with said cured product |
| abstract |
A phenolic resin which is represented by general formula (1) and can impart a thermal expansion coefficient of 1.5% or more to a cured article, which is an article produced from the phenolic resin, an epoxy resin represented by general formula (2) and a curing accelerator, at a temperature of 40 to 180°C inclusive. The phenolic resin is preferably one which can impart a storage modulus of 15 MPa or more to the cured article at 250°C. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2022102489-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017128657-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022102489-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7205673-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017105898-A |
| priorityDate |
2014-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |