| abstract |
Provided are a curing resin composition which has transparency, heat resistance, and pliability, as well as having thermal shock resistance and reflow resistance, which moreover has barrier properties with respect to hydrogen sulfide (H 2 S) gas and sulfur oxide (SO X ) gases, and which is useful in sealing applications for semiconductor elements (especially optical semiconductor elements); and a cured article, sealing material, and semiconductor device employing the same. Provided are a curing resin composition containing (A) a polyorganosiloxane, (B) a silsesquioxane, and (C) an isocyanurate compound, the polyorganosiloxane (A) being a polyorganosiloxane having an aryl group, and the curing resin composition having viscosity of 4,000-8,000 mPa·s; and a cured article, sealing material, and semiconductor device employing the same. |