| abstract |
Provided are: a curable resin composition provided with transparency, heat resistance, and flexibility, as well as with re-flow resistance, and also barrier properties with respect to hydrogen sulfide (H 2 S) gas and barrier properties with respect to sulfur oxide (SO X ) gas, and that is useful in sealing applications for semiconductor elements (particularly optical semiconductor elements); a cured product using the same; a sealing material; and a semiconductor device. A curable resin composition, and a cured product, sealing material, and semiconductor device using the same, the curable resin composition including a polyorganosiloxane (A), an isocyanurate compound (B), and a zinc compound (E), the polyorganosiloxane (A) being a polyorganosiloxane having an aryl group, the curable resin composition potentially further including a silsesquioxane (D), and the content of the zinc compound (E) being less than 0.01 part by weight to 0.1 part by weight with respect to the total amount (100 parts by weight) of the polyorganosiloxane (A) and the silsesquioxane (D). |