| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2471-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2463-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-121 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5073 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2014-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c65c12aa56066b803e2895b78159494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b87d46d2bdae9aff164405dc28b58616
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5ad16ab91003094ab321c9c47e4991e |
| publicationDate |
2014-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2014125763-A1 |
| titleOfInvention |
Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board |
| abstract |
The present invention relates to a resin composition which is characterized by containing: a reaction product which contains a polyphenylene ether (A) having an average of 1.5-2 hydroxyl groups per molecule and an epoxy compound (B) having an average of 2-2.3 epoxy groups per molecule, and which is obtained by causing at least some hydroxyl groups of the polyphenylene ether (A) to react with the epoxy groups of the epoxy compound (B) in advance so that the terminal hydroxyl group concentration of the polyphenylene ether (A) is 700 μmol/g or less; a cyanate ester compound (C); and an organic metal salt (D). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11267225-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017134716-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104927576-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108602318-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108602318-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017136786-A |
| priorityDate |
2013-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |