| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2250-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2250-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2262-0276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2262-0269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2262-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-752
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-748
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-732 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2016-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-108602318-B |
| titleOfInvention |
Metal clad laminate, method for producing metal clad laminate, metal member with resin, method for producing metal member with resin, wiring board, and method for producing wiring board |
| abstract |
A metal-clad laminate comprising an insulating layer and a metal layer present in contact with at least one surface of the insulating layer, wherein the insulating layer includes a cured product of a thermosetting resin composition containing 1 molecule of the thermosetting resin composition A reaction product of a polyphenylene ether having an average of 1.5 to 2 hydroxyl groups and an epoxy compound having an average of 2 to 2.3 epoxy groups in one molecule. The terminal hydroxyl group concentration of the reaction product is 700 μmol/g or less, the metal layer includes a metal substrate, and a barrier layer containing cobalt provided at least on the contact surface side of the metal substrate that is in contact with the insulating layer, and the surface roughness of the contact surface is ten The point average roughness Rz is 2 μm or less. |
| priorityDate |
2016-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |