| abstract |
Provided is a positive photoresist composition having excellent heat resistance. Also provided is a radically curable compound, characterized in being represented by general formula (1) (where R 1 , R 2 , and R 3 are each independently a C 1-8 alkyl group; m and n are each independently integers of 1 to 4; p is an integer of 0 to 4; X, Y, and Z are each independently either an acryloyloxy, methacryloyloxy, or hydroxyl group where at least one of X, Y, and Z is an acryloyloxy or methacryloyloxy group; and t is 1 or 2.). |