| abstract |
Provided is a backing-supported layered polyimide which has a smooth surface to enable a sophisticated device to be formed thereon and in which the layered polyimide does not readily peel off even in a high-temperature process for device formation and can be easily separated from the backing after the device formation on the layered polyimide.nA polyimide film is used in which the surface that is to face a backing has undergone a surface treatment. At least either of the surfaces of the backing and polyimide film which are to face each other is patterned using a coupling agent to form a satisfactorily bondable part and an easily releasable part which differ in adhesion/peel strength. Thereafter, the backing and the polyimide film are superposed and laminated by pressing and heating. The surface of the polyimide film is treated with an organic alkali, and subsequently a polyamic acid solution containing no lubricant ingredient is applied and then dried and imidized. Thus, a layered product which has a structure composed of at least three layers and has one or more layers that contain a lubricant and in which both surfaces contain no lubricant is produced. |