| abstract |
[Problem] To provide a technique for efficiently bonding a chip to a wafer without leaving undesirable residue such as resin on the bonding interface, establishing electrical connections between the chip and wafer or among a plurality of layered chips, and increasing mechanical strength. [Solution] The method of the present invention for bonding a plurality of chips with chip-side bonding surfaces comprising metal regions to a substrate comprising a plurality of bonding sections is provided with the following steps: (S1) wherein the metal regions of the chip-side bonding surfaces are subjected to a surface activation treatment and a hydrophilization treatment; a step (S2) wherein the bonding sections of the substrate are subjected to a surface activation treatment and a hydrophilization treatment; a step (S3) wherein each of the plurality of chips, which have been subjected to the surface activation treatment and the hydrophilization treatment, is attached to the corresponding bonding section on the substrate, which has been subjected to the surface activation treatment and the hydrophilization treatment, so that the metal regions of the chips are in contact with the bonding sections of the substrate; and a step (S4) wherein the structure comprising the substrate and the plurality of chips attached to the substrate is heated. |