http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012133225-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5e4c48663fb899e6ce58f22de5af1d2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b20531ec602bdfbc03a614eb87fe1aac http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0bbdccbf65141ef5d3084484af7bfbf2 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2012-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ba520eb63b1763f73f59f2dc1e17ef7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b12820301d4777b34c89182df01985bc |
| publicationDate | 2012-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2012133225-A1 |
| titleOfInvention | Electro copper plating additive and electro copper plating bath |
| abstract | Provided is an electro copper plating additive which forms a uniform plating film from low current density parts to high current density parts, imparting a lustrous shine, and which is not depleted when the bath is not in use. Also provided is an electro copper plating bath containing the additive. The present invention involves adding an electric copper plating additive comprising a block polymer compound represented by general formula (1) below to an electro copper plating bath. (In the formula, R represents a straight-chain or branched-chain alkenyl group or alkyl group having 1 to 15 carbon atoms, m is an integer from 1 to 30, and n is an integer from 1 to 40.) |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105917032-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015077772-A1 |
| priorityDate | 2011-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.