http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010255078-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_de498babb0c04a00ceb653738877b147 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2009-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e68d28f050e454070b471235850e5096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_749afa2e3b726149367bdd138a0303b6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0600cc9da09628e04617aa5f17f7364 |
| publicationDate | 2010-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010255078-A |
| titleOfInvention | Electrolytic copper plating bath and electrolytic copper plating method |
| abstract | An object of the present invention is to provide an electrolytic agent containing, as essential active ingredients, an inhibitor capable of satisfactorily embedding copper in a groove or hole by electrolytic copper plating, even with a fine structure, and an accelerator and a smoothing agent. The object is to provide a copper plating bath and an electrolytic copper plating method using the electrolytic copper plating bath. The present invention provides an inhibitor comprising a specific block polymer compound in an amount of 0.001 to 5% by mass; a specific accelerator in an amount of 0.01 to 100 ppm by mass; and a salt / maleine of diallylamine and a sulfate compound. Acid copolymer, vinylpyrrolidone / N, N-dimethylaminoethyl methacrylate copolymer and sulfuric acid salt, methylvinylimidazolium / vinylpyrrolidone copolymer, N-acyl-N′-carboxyethyl-N Contains 0.01 to 250 ppm by mass of at least one leveling agent selected from '-hydroxyethylethylenediamine or an alkali metal salt thereof (wherein acyl represents an aliphatic acyl group having 8 to 20 carbon atoms). The present invention relates to an electrolytic copper plating bath. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012201976-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012133225-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9562299-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10468364-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014197038-A1 |
| priorityDate | 2009-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 105.