| abstract |
Disclosed is a thermoplastic resin which can greatly increase thermal conductive ratio in a resin composition when said composition comprises thermally conductive filler, and which is capable of being injection moulded even in multipurpose injection moulding moulds. The thermoplastic resin is characterised in that a principal chain is mainly formed by repeated specified units, and 60 mol% or more of molecular chain ends are a carboxyl group. |