http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011063790-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G63-02 |
filingDate | 2010-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbee9d7ccebcd03a0a407cb412e9465e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37b650367f25ccc162c7ad1dd7a84001 |
publicationDate | 2011-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2011063790-A |
titleOfInvention | High thermal conductivity thermoplastic resin |
abstract | PROBLEM TO BE SOLVED: To provide a heat-resistant thermoplastic resin having high thermal conductivity by itself without blending a high thermal conductive inorganic filler and capable of being injection-molded even by a general-purpose injection mold. To provide a plastic resin. SOLUTION: At least one diffraction peak derived from a resin at 2θ = 35 ° to 50 ° and having a half-value width of 1 ° or less is observed by XRD measurement on the surface of a resin molded body. resin. The thermoplastic resin preferably has a main chain mainly composed of repeating units of units represented by mesogenic groups and spacers, and is mainly composed of a chain structure. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011132390-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5941840-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9234095-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8921507-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8946335-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011132389-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8637630-B2 |
priorityDate | 2009-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 230.