| abstract |
Disclosed is a radiation-sensitive resin composition which is suitable for a liquid immersion exposure process for the formation of a resist pattern, and is also suitable for development by an organic solvent.nSpecifically disclosed is a radiation-sensitive resin composition which is used in a resist pattern forming method wherein development is carried out by an organic solvent (X). The radiation-sensitive resin composition is characterized by containing (A) a polymer, (B) a radiation-sensitive acid generator, and (C) a solvent, and is also characterized in that the polymer (A) contains at least one repeating unit (a2) that is selected from formula (1-1) to formula (1-7). |