http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011116326-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2572eea64db35863f24d0a92c50e0699 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7584a4b4b7e7300b30137d6e151fa1b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6fc946377c50d4810b380df6bc77e596 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_82a9e22a923eca64a02a97f0dfb493ed |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2011-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00dd009af2ca6b280c0dee2483f18dc4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2a46c2f7c71f15fc82c856157af42ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7039ac31c4fd399f52ce52e62729e4e |
| publicationDate | 2011-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2011116326-A1 |
| titleOfInvention | Through-silicon via fabrication with etch stop film |
| abstract | For a semiconductor wafer substrate (102) having an inter layer dielectric (110), a through - silicon via may be formed in the substrate by first depositing an etch stop film (202) on top of the inter layer dielectric, followed by etching an opening (204) through the etch stop film, the interlayer dielectric, and into the substrate. A dielectric liner (206) is then deposited over the etch stop film and into the opening. For some embodiments, the dielectric liner may be etched away except for those portions adhering to the sidewall of the opening. Then a conductive material (208) may be deposited into the opening and on the etch stop film. The excess conductive material may then be removed, and for some embodiments the etch stop film may also be removed. |
| priorityDate | 2010-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.