| abstract |
Disclosed is a polysiloxane positive radiation-sensitive composition that has sufficient radiation sensitivity and excellent melt-flow resistance in a heating step after developing, and that is used favorably in forming: a cured film having excellent heat resistance, transparency, solvent resistance, and low dielectric properties; and a liquid crystal cell having a high voltage holding ratio. Further disclosed are the cured film formed from the composition, and a method for forming the cured film. The positive radiation-sensitive composition contains [A] a siloxane polymer, [B] a quinone diazide compound, and [C] a radiation-sensitive acid generator having a wavelength of maximum absorption that is shorter than the wavelength of maximum absorption of [B] the quinone diazide compound. |