| abstract |
An integrated circuit (IC) (500) has an under-bump metal (UBM) pad (504) disposed between a solder bump (502) and a semiconductor portion (518) of the IC. The UBM pad has a contact perimeter (510) formed with the solder bump. The UBM pad extends beyond the contact perimeter a sufficient distance to block alpha particles (512, 514) emitted from the surface of the solder bump from causing an upset event in the semiconductor portion. Methods of fabricating such an IC are also described. |