| abstract |
Disclosed is a vapor deposition apparatus wherein a mask unit (80), which comprises a shadow mask (81) that has an opening portion (82) and an area smaller than that of a vapor deposition region (210) of a substrate (200) on which a film is formed and a vapor deposition source (85) that has an ejection port (86) for ejecting vapor deposition particles such that the ejection port (86) faces the shadow mask (81) with the relative positions of the shadow mask (81) and the vapor deposition source (85) being fixed, is used, and the vapor deposition particles are sequentially deposited on the vapor deposition region (210) through the opening portion (82) of the shadow mask (81) by relatively moving at least one of the mask unit (80) and the substrate (200), while adjusting the gap between the shadow mask (81) and the substrate (200) so that the gap between the mask unit (80) and the substrate (200) becomes constant. Consequently, a highly fine vapor deposition pattern is able to be formed on a large-sized substrate. |