| abstract |
Disclosed is an epoxy resin composition, which shows flame retardancy and heat resistance that are required for a laminate or a multi-layer board, has excellent dielectric properties and, at the same time, shows no lowering in interlayer adhesiveness.nThe epoxy resin composition comprises: a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). As the polyphenylene ether compound (B), the epoxy resin composition contains: a polyphenylene ether (B1) having a number-average molecular weight of 500-3000 and having 1.0-3.0 hydroxyl groups on average per molecule; an epoxy resin (B2) obtained by reacting said polyphenylene ether (B1) with an epoxy resin (D) having 2.3 or less epoxy groups on average per molecule; or the like. The epoxy resin composition contains a phosphorus-modified epoxy resin (P) in at least one component selected from among said polyfunctional epoxy resin (A), said epoxy resin (D) and a component other than said (A), (B) and (C). The content of phosphorus is 1.5-4.5% by mass relative to the resin solid matters contained in the epoxy resin composition. |